The IEC is in the process of endorsing IPC-A as the globally preferred international acceptance standard for electronics assembly. AE training for through hole and surface mount solder joint acceptance standards inspection from IPC, a trade association for the electronics industry. IPC-AG is the latest revision of the most widely used electronics assembly standard in the world. IPC AG is now available from.

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IPC-AE IPC Certification

Acceptability of Electronic Assemblies. To view this site, you must enable JavaScript or upgrade to a JavaScript-capable browser.

IPC-A is invaluable for all inspectors, operators and trainers. Please allow 2 business days for us to review and process your order.

IPC Media Training and Certification for Electronics Assembly

IPC’s most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.

Training Media Permissible Uses. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD Javascript is disabled on your browser. IPC J-STDE provides material and process requirements for producing soldered electrical and electronic assemblies, aiding those who set up manufacturing processes. IPC-A is the most widely used electronics assembly standard in the world.


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IPC-A-610E IPC Certification

The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A, have also been upgraded. This revision has been critically reviewed for clarity and 6110e.

There are new sections on depanelization, board in board, package on package, and flex attachment, which Jack Crawford, IPC director of certification, calls “high interest topics. A must for all quality assurance and assembly departments, IPC-AE illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. 6610e many changes that have occurred in array i;c since the standard’s last revision are also addressed in the E revision, as are changes to hot tear and fillet lifting.

Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT new termination ip and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. The E revision contains new or updated illustrations, bringing the total to more than Revision E has photos and illustrations of acceptability criteria of them new or updated. Chinese – Download – Single-User License: In addition, the standard has been revamped for ease of use and clarity.


Translations of the revised standard in multiple languages will be released in the coming months. Designers and manufacturers will appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular kpc the assembly using a through-the-board method.

We will continue to accept orders via e-mail and web during our office closure.

For more information on IPCE, visit www. Zenaida Valianu, training and development specialist at Celestica agrees, “The ipcc is more intuitive and manageable than before, allowing users to navigate more easily and locate information promptly.

IPC maintains additional offices in Taos, N. Sections have been reorganized so data and images are easier to find and to make it easier to use.